At its developer forum being held this week in San Diego, California, Intel has offered a glimpse into its plans for mobile and wireless technologies, including an upgrade to the popular Centrino platform, several new dual-core chips, and a chipset that will support both Wi-Fi and WiMax connections.
This type of improvement in mobile technology is not a small thing, we have to take this seriously, this can change a lot of things in the mobile world. Whenever it comes to a chipset upgrade, we have to be prepared because the next generation of chips can perform a lot faster and better than any previous one. A chipset that could support both Wi-Fi and Wimax connections is something that we haven’t been able to see before and we are very excited for that. Wi-Fi connections are very important in every mobile device nowadays because for some people that is the only way they can connect with the internet and browse the web. People have been putting more and more effort and dedication towards the mobile technology and because of that we are now having these types of improvements that can allow us to use these devices for much more than just talking.
The next generation of Intel’s Centrino platform is codenamed Santa Rosa and will feature a more powerful processor, an improved graphics chipset, and support for the forthcoming 802.11n Wi-Fi standard. In addition, the Santa Rosa platform will include a flash-memory-based accelerator, codenamed Robson, that Intel claims will help laptops boot more quickly and use less power.
“Emerging applications such as mashups, blogs, podcasts, and RSS make the Internet an even more personal and interactive experience, and people want to carry those experiences with them,” said Sean Maloney, Intel’s executive vice president, in a statement. “The next stage of Internet growth is to make this ‘real Internet’ mobile.”